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Soldering FluxFlux chemically removes oxide film from the to-be soldered metal surface, and the molten solder surface, thereby exposing solderable metal surfaces. Flux is therefore indispensable in all soldering processes, including PC board and special metals. It must possess the correct characteristics to meet specific application requirements. From Senju metal Industry's long experience, we have developed various types of flux, including PC board flux, all of which provide unrivaled performance.
Flux: Typical Products & SpecificationProductsPhysical PropertyFeatures & UsesSolidContent(wt %)SpecificGravity(20 °C)Viscosity(20°C)(cP)Chlorine Content(%)ResinTypeGeneralUsePO-F-1010SPO-F-1010KES-1061SP-2LowerResiduePO-F-009MPO-F-710RMASR-209SR-12Water-SolubleTypeGeneral UseWF-2050Preliminarysoldering of partsWF-3041Tinning FluxT-1
15 | 0.823 | 4.5 | 0.07 | Chip mounted & high density boards, standard type. |
17 | 0.825 | 4.1 | 0.07 | Prevention of dew condensation. |
15 | 0.826 | 4.0 | 0.09 | Pb-free soldering. |
9 | 0.807 | 3.2 | 0.06 | Chip mounted & high density boards, lower residue, spray coating. |
9 | 0.807 | 3 | 0.06 | Chip mounted & high density boards, spray coating, lower residue. |
12 | 0.820 | 3.7 | *RMA | Lower residue, non-cleaning, lusterless type. |
12 | 0.818 | 3.6 | *RMA | Lower residue, non-cleaning. lustrous type. |
20 | 0.887 | 6.7 | 2.00 | High density electronic boards. |
46 | 1.156 | 6.1 | 0.000 | Soldering of nickel & copper based alloys, halogen-free. |
1 | 0.829 | 3.0 | 0.16 | Tinning for lead wire, negligible residues. |
备注:由于市场供需的变动和人民币汇率的调整,本公司拥有对本产品价格的绝对解释权。