1756-HSC

 1756-HSC
1756-HSC
1756-HSC

2.根据PCB板的材料、厚度、是否多层板、尺寸大小进行设置。

   3.根据表面组装板元器件的密度、元器件的大小以及有无BGA、CSP等特殊元器件进行设置。

   4.此外，根据设备的具体隋况，例如加热区的长度、加热源的材料、回流焊炉的构造和热传导方式等因素进行设置。

   5.根据温度传感器的实际位置确定各温区的设置温度，若温度传感器位置在发热体内部，设置温度比实际温度高30℃左右。

   6.根据排风量的大小进行设置。一般回流焊炉对排风量都有具体要求，但实际排风量因各种原因有时会有所变化，确定一个产品的温度曲线时，因考虑排风量，并定时测量。
 

◆ 企业名称：厦门泰尼电气有限公司

◆ 企业性质： 有限责任公司

◆ 主营业务：DCS,PLC

◆ 经营模式： 贸易

◆ 贸易地区： 全国

◆ 联系人： 小刘（女士）

◆ 电话：0592-6809320  

◆ 联系手机：18950191376 

◆ QQ:3073879392 

◆ 传真：0592-6890859 （备注“01007”收）

◆ E-mail：3073879392@qq.com 

◆ 邮政编码： 361026

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