ALPHA EF6000免清洗适用于有铅及无铅应用

ALPHA EF6000免清洗适用于有铅及无铅应用

No-Clean Flux for LEAD-FREE & Sn-Pb WAVE SOLDERING

ALPHA EF-6000 was specifically developed to deliver outstanding board cosmetics and to eliminate the tendency for solder balling and solder bridging, two types of defects which are normally associated with the use of the chip wave. Of all low solids (< 4% solids), no-clean fluxes, ALPHA EF-6000 exhibits the lowest tendency for solder ball generation over a wide variety of solder masks during wave soldering and Selective Soldering operations. ALPHA EF-6000 should be considered for use by any assembler who has board designs which are sensitive to solder bridging, performs pin testing, or whose specification requires an extremely low frequency of solder balls.

GENERAL DEscriptION

ALPHA EF-6000 is an active, low solids, no-clean flux. It has been designed with a wide thermal process window enabling best-in-class productivity with lead-free wave soldering applications, and is an excellent choice for remaining tin-lead production lines. It is formulated with a proprietary mixture of organic activators. Several proprietary additives are formulated into ALPHA EF-6000 to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solder ball generation. The formulation of ALPHA EF-6000 is also more thermally stable, thereby, reducing the occurrence of solder bridging during lead-free dual wave soldering.

FEATURES & BENEFITS

•Thermally stable activators provide the lowest solder bridging in a low-solids, no-clean flux for wave soldering and Selective Soldering in tin-lead and lead-free applications.

•Reduces the surface tension between solder mask and solder to provide the lowest solder ball frequency of any low solids, no-clean flux.

•Very low level of non-tacky residue to reduce interference with pin testing and exhibit no visible residue.

•Cleaning is not required which reduces operating costs.

•IPC-J-STD-004 compliant for long term electrical reliability.

APPLICATION GUIDELINES

PREPARATION - In order to maintain consistent soldering performance and electrical reliability, it is important to begin the process with circuit boards and components that meet established requirements for solderability and ionic cleanliness. It is suggested that assemblers establish specifications on these items with their suppliers and that suppliers provide Certificates of Analysis with shipments and/or assemblers perform incoming inspection. A common specification for the ionic cleanliness of incoming boards and components is 5µg/in2 (0.77µg/cm2 ) maximum, as measured by an Omegameter with heated solution.  

Care should be taken in handling the circuit boards throughout the process. Boards should always be held at the edges. The use of clean, lint-free gloves is also recommended. When switching from one flux to another, the flux reservoir, flux tank and lines of the spray fluxer assembly should be purged with IPA. Conveyors, fingers and pallets should be cleaned periodically with DI Water, IPA or other commercial Solvent Cleaners to eliminate residues on the assembly edges.

FLUX APPLICATION–ALPHA EF-6000 is formulated to be applied by spray methods. A uniform coating of flux is

essential to successful soldering. When spray fluxing, the uniformity of the coating can be visually checked by running a piece of cardboard over the spray fluxer or by processing a board sized piece of tempered glass through the spray and then through the preheat section.